Assembly for packaging microcircuits having gold plated groundin

Details Assembly for packaging microcircuits having gold plated groundin Assembly for packaging microcircuits having gold plated groundin

1985-09-03

1987-11-17

Grimley, Arthur T.

Metal working

Method of mechanical manufacture

Electrical device making

29418, 29884, 174 52FP, H01R 4320

Patent

active

047063823

ABSTRACT:
A plated metal assembly used for packaging hybrid microcircuits features both insulated and grounding leads plated with successive layers of nickel and gold, the leads attached to a metal header which is plated only with nickel. A method for mass producing the assembly includes pre-plating the grounding leads, and brazing them to the header after the header and insulated leads have been assembled and plated.

REFERENCES:
patent: 3793709 (1974-02-01), Baumann
patent: 4128697 (1978-12-01), Simpson
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4412093 (1983-10-01), Wildeboer
patent: 4453033 (1984-06-01), Duff et al.
patent: 4465742 (1984-08-01), Nagashima et al.

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