Assembly for mounting semiconductor chips in a full-width-array

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

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257448, 257459, 257434, H01L 3100

Patent

active

055459137

ABSTRACT:
An assembly facilitates mounting a set of abutted semiconductor chips, such as chips aligned to form a single full-page-width linear array of photosensors in a digital scanner or copier. An elongated bead of electrically conductive adhesive extends along a surface of a support substrate. A plurality of semiconductor chips is disposed along the elongated bead, each semiconductor chip including a linear array of photosensors on a front surface thereof, and a back surface attached to the support substrate by the electrically conductive adhesive. A connection block is disposed along another portion of the elongated bead, the block including a first surface contacting the bead, a second surface, and a conductor extending from the first surface to the second surface.

REFERENCES:
patent: 4954197 (1990-09-01), Jedlicka et al.
patent: 4976802 (1990-12-01), LeBlanc
patent: 5034083 (1991-07-01), Camparelli et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5326414 (1994-07-01), Mosher et al.

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