Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-09-26
1996-06-18
Sparks, Donald A.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361695, 361767, 361769, 361771, 439 66, 439 73, 439 91, H05K 720, H05K 712
Patent
active
055284663
ABSTRACT:
An assembly for mounting a plurality of electrical components having terminals with leads onto a surface of a printed circuit board is disclosed. The assembly includes a substantially planar configured electrically insulated body member having top to bottom surfaces. Cavities extend through the body member and are dimensioned for receiving an electrical component and holding the component laterally by the walls defining the cavity. An elastomer element with conductive portions is positioned adjacent to the bottom surface of the cavities and receives the leads of electrical components. A lid is connected to the body member and movable from an open position for allowing insertion and removal of electrical components to and from the cavities, and a closed position where the lid covers the cavities. The lid includes plungers for pressing without excessive force the leads of the electrical components against the elastomeric connector(s) and into contact with the wiring pattern on a printed circuit board positioned adjacent the bottom surface of the body when the lid is in its closed position.
REFERENCES:
patent: 3877064 (1975-04-01), Sheingold et al.
patent: 3917984 (1975-11-01), Kong et al.
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 4166665 (1979-09-01), Cutchaw
patent: 4288841 (1981-09-01), Gogal
patent: 4324040 (1982-04-01), Gottlieb
patent: 4593961 (1986-06-01), Cosmo
patent: 4652973 (1987-03-01), Baker et al.
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4706161 (1987-11-01), Buckingham
patent: 4717346 (1988-01-01), Yoshizaki
patent: 4758176 (1988-07-01), Abe et al.
patent: 4766371 (1988-08-01), Moriya
patent: 4778950 (1988-10-01), Lee et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4955818 (1990-09-01), Strange et al.
patent: 5000696 (1991-03-01), Matsuoka et al.
patent: 5086269 (1992-02-01), Nobi
patent: 5100332 (1992-03-01), Egawa
patent: 5127837 (1992-07-01), Shah et al.
patent: 5175491 (1992-12-01), Ewers
patent: 5196785 (1993-03-01), Douglas
patent: 5206792 (1993-04-01), Reynolds
patent: 5243498 (1993-09-01), Scofield
patent: 5273441 (1993-12-01), Volz et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5360348 (1994-11-01), Johnson
Research Disclosure "Vacuum Attachment of Heat Sink during Testing" Jan. 1993, No. 345.
Elastomeric Connector Catalog, Elastomeric Technologies, Inc. 1989.
Buchoff, Solving High Density Electronic Problems With Elastomeric Connectors, Elastomeric Technologies, Inc. 1989.
Elastomeric Connector Catalog, Elastomeric Technologies, Inc. 1989.
Lim Samuel S. S.
Tan Siew K.
Sparks Donald A.
Sunright Limited
LandOfFree
Assembly for mounting and cooling a plurality of integrated circ does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Assembly for mounting and cooling a plurality of integrated circ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly for mounting and cooling a plurality of integrated circ will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-227755