Assembly for dissipating thermal energy contained in an electric

Heat exchange – Line connected conduit assemblies

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 257713, 257721, 361689, 361691, F28F 926

Patent

active

055094686

ABSTRACT:
An assembly, and associated method, for dissipating thermal energy contained in a circuit element of an electrical circuit which is releasably connectable with a substrate to form an electrical connection with the substrate when connected therewith. A fluid conduit extends through a plate member which is positionable proximate to the circuit element to be moveable therewith. The fluid conduit is coupled to a fluid manifold when the electrical circuit forms the electrical connection with the substrate. Coolant fluid is supplied to the manifold and, when the fluid conduit is coupled to the fluid manifold, also the fluid conduit. Thermal energy generated during operation of the electrical circuit is transferred to the coolant fluid flowing through the fluid conduit. The location of the fluid conduit is repositionable responsive to reconfiguration of the electrical circuit.

REFERENCES:
patent: 2943842 (1960-07-01), Sullivan
patent: 3199584 (1965-08-01), Heuer
patent: 3334684 (1967-08-01), Roush et al.
patent: 3481393 (1969-12-01), Chu
patent: 4009423 (1977-02-01), Wilson
patent: 4315300 (1982-02-01), Parmerlee et al.
patent: 4485429 (1984-11-01), Mittal
patent: 4682032 (1987-07-01), Barrett
patent: 4712158 (1987-12-01), Kikuchi et al.
patent: 4759403 (1988-07-01), Flint et al.
patent: 4809058 (1989-02-01), Funamoto et al.
patent: 4865123 (1989-09-01), Kawashima et al.
patent: 5088005 (1992-02-01), Ciaccio
patent: 5144531 (1992-09-01), Go et al.
Cannistra et al., Module Board Service Frame, Jul. 1979, vol. 22, No. 2, pp. 688-689.
"Aavid aims to cool Pentium", Electronic Engineering Times, Aug. 9, 1993, p. 64.
CPC Coupling Form CP-1 by Colder Products Company, Revision 2, pp. 4-5, Sep., 1990.
"Controlled-Disbond Cladding Adds New Dimension to Metalworking", Design News, 1986.
"Computer Performance is Improved by using Unique Thermal Management and Computer Chip Cooling Technologies", MMR Technologies, Inc. Technical Brief.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Assembly for dissipating thermal energy contained in an electric does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembly for dissipating thermal energy contained in an electric, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly for dissipating thermal energy contained in an electric will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2302713

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.