Assembly for connecting plates

Details Assembly for connecting plates Assembly for connecting plates

2011-01-25

2011-01-25

Tran, Hanh V (Department: 3637)

Supports: cabinet structure

For particular electrical device or component

Housing for computer or computer related equipment

C312S265500, C312S319100

Reexamination Certificate

active

07874627

ABSTRACT:
An assembly for connecting plates is provided. A first plate has a first opening and a second opening; a metal wire is movably connected to one surface of the first plate, and the metal wire includes a bending portion corresponding to the position of the first opening; a spring connects the first plate and the metal wire; a pressing element is fixed on the metal wire and passes through the second opening of the first plate to protrude from the other surface of the first plate. The second plate has a hook. When the first plate and the second plate are assembled, the hook of the second plate passes through the first opening of the first plate, and the bending portion of the first plate prevents the hook from separating from the first opening by tension force of the spring thus to connect the first plate and the second plate.

REFERENCES:
patent: 5713647 (1998-02-01), Kim
patent: 6109710 (2000-08-01), Wu et al.
patent: 6816391 (2004-11-01), Davis et al.
patent: 6899407 (2005-05-01), Lai
patent: 6906927 (2005-06-01), Su
patent: 6932447 (2005-08-01), Chen et al.
patent: 7082036 (2006-07-01), Cheng et al.
patent: 7180013 (2007-02-01), Peng et al.
patent: 7404610 (2008-07-01), Smith et al.
patent: 2005/0040740 (2005-02-01), Yun
patent: 2006/0028103 (2006-02-01), Smith et al.

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