Assembly and testing of electronic power components insulation

Details Assembly and testing of electronic power components insulation Assembly and testing of electronic power components insulation

1992-07-30

1994-05-24

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 174138G, 324537, 324555, 361709, H05K 334

Patent

active

053137019

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

The present invention relates to a method for assembly and testing the insulation of electronic power components in electrical switching and control devices.
More particularly, it relates to a method for assembly and testing the insulation of such control devices, particularly for motor vehicles which are fastened to a heat sink so as to be thermally conducting and electrically insulating, which heat sink fits securely on a printed circuit board on which the power components and additional electrical component elements are connected via conductor path by soldering together with connection parts and a circuit ground.
It is already known from DE-OS 33 31 207 to fasten the electronic power components at a heat sink via a thermally conducting insulating foil by means of a plastic fastening part and to perform electrical testing of the component group preassembled in this way. High voltage is applied for testing the insulation between the heat sink and power components. The preassembled component group is then fastened on the printed circuit board and the connection pins of the power components must be inserted into the holes of the printed circuit board assigned to them in a costly and cumbersome manner. The power components are then connected with additional electronic component elements on the printed circuit board by soldering. In such switching and control devices for motor vehicles the component elements on the printed circuit board generally form a logic and the power components form the end stages in the form of power transistors.
The aforementioned method for assembly and testing the insulation between the heat sink and power components is supposed to ensure that sensitive component parts, e.g. computers, on the printed circuit board are not destroyed by high voltage. However, the known solution has the disadvantage that the insertion of the preassembled heat sink and power component group into the printed circuit board poses considerable problems, particularly with bent connection pins, so that mechanical assembly is not possible.


SUMMARY OF THE INVENTION

Accordingly, it is an object of the present invention to provide a method for assembly and testing the insulation of electrical power components of heat sinks which avoids the disadvantages of the prior art.
In keeping with these objects and with others which will become apparent hereinafter, one feature of the present invention resides, briefly stated, in a method in accordance with which the heat sink is first fastened to a printed circuit board so as to be free of potential, the power components are now inserted into the printed circuit board so as to be thermally conducting and electrically insulated at the heat sink, and the connection pins of the power components are soldered with the conductor paths of the printed board, the insulation between the potential-free heat sink and the power components is then tested by applying high voltage, and the heat sink is finally electrically connected with the circuit ground.
The process according to the invention for assembly and testing the insulation of the electronic switching and control device has the advantage that the heat sink is free of potential when testing the insulation so that the high voltage applied between it and the power components connected with the printed circuit board can not act on the rest of the voltage-sensitive components on the printed circuit board. A further advantage consists in that the power components can now be inserted into the corresponding holes of the printed circuit board individually and therefore with substantially fewer problems and therefore also mechanically.
All components and component parts can now be easily inserted into the printed circuit board individually and directly from above with the aid of insertion means, protuberances and fixing pins, and defective component elements can be easily removed and exchanged. The insertion means provide a simple, inexpensive and quick assembly since only the connection pins of the compon

REFERENCES:
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patent: 4498120 (1985-02-01), Kaufman
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patent: 4724514 (1988-02-01), Kaufman
patent: 4756081 (1988-07-01), Penn
patent: 4965699 (1990-10-01), Jorden et al.
patent: 4979074 (1990-12-01), Morley et al.
patent: 5068708 (1991-11-01), Newman

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