Thermal measuring and testing – Thermal testing of a nonthermal quantity – Expansion or contraction characteristics
Patent
1989-01-24
1990-05-08
Cuchlinski, Jr., William A.
Thermal measuring and testing
Thermal testing of a nonthermal quantity
Expansion or contraction characteristics
356358, 269 55, 364562, G01N 2516, G01B 1102
Patent
active
049244779
ABSTRACT:
An assembly and method suitable for determining the coefficient of thermal expansion (CTE) of a workpiece. The assembly includes a dual channel laser interferometer system placed in operative association with the workpiece, and a vacuum, heating and cooling chamber surrounding the workpiece. The assembly is particularly useful for determining the CTE of a workpiece having a relatively low value, e.g., a CTE less than 0.1.times.10.sup.-6 inch/inch .degree.F. It is therefore advantageously employed for determining the CTE of a workpiece comprising a composite, like a graphite/epoxy composite, that may have a CTE in the range of .+-.0.2.times.10.sup.-6 inch/inch .degree.F.
REFERENCES:
patent: 2689474 (1954-09-01), Wachtel
patent: 3176499 (1965-04-01), Sikora
patent: 3898836 (1975-08-01), Clusener
patent: 4282688 (1981-08-01), Krim
patent: 4643577 (1987-02-01), Roth et al.
Ruffino, et al., "Fast Interferometric Dilatometer", AIP Conf. Proc. (U.S.A.), no. 17 (1973), pp. 159-166.
Wielke, B., "A Variable Temperature, Tensile Testing Cryostat", Cryogenics, vol. 16, No. 2, pp. 110-112, (Feb. 1976).
Kirchner, T. L., "Laser Interferometer System for the Measurement of Creep in Pressurized Tubes", Laser & Electro-Optic (Germany), vol. 9, pp. 30-31, 34-36 (1977).
Blankinship, E. A., "An Automated Optical Dilatometer for Inhomogeneously Expanding Material", AIP Conf. Proc. (U.S.A.), no. 17 (1973).
Okaji, M. et al., "An Interferometric Dilatometer and Supporting Systems of the Specimen", Oyo Bukuri (Japan), vol. 50, No. 7 (Jul. 1981).
Gilmore James F.
Kirk Charles S.
Lloyd Carl A.
Cuchlinski Jr. William A.
Eastman Kodak Company
Gutierrez Diego F. F.
Kaufman Stephen C.
LandOfFree
Assembly and method for determining the coefficient of thermal e does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Assembly and method for determining the coefficient of thermal e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembly and method for determining the coefficient of thermal e will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2355350