Assembling substrates that can form 3-D structures

Details Assembling substrates that can form 3-D structures Assembling substrates that can form 3-D structures

2011-08-09

2011-08-09

Garber, Charles (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C336S040000, C336S073000, C257S723000, C257S724000, C257S777000, C257S778000, C257SE23010, C257SE23057

Reexamination Certificate

active

07993968

ABSTRACT:
A system is described that connects the surface of a first substrate to the edge of a second substrate. The surfaces of additional substrates can be placed on the remaining edges of the second substrate to form a 3-D structure. Rigid support substrates can be connected to the first substrate to provide support for the first and additional substrates. The second substrate can be used to carry heat, fluids, electrical power or signals between first and additional substrates besides providing a mechanical support.

REFERENCES:
patent: 4228527 (1980-10-01), Gerber et al.
patent: 4848536 (1989-07-01), Machida
patent: 4885719 (1989-12-01), Brahmbhatt
patent: 4947228 (1990-08-01), Gabara
patent: 5095401 (1992-03-01), Zavracky
patent: 5298800 (1994-03-01), Dunlop
patent: 5317202 (1994-05-01), Waizman
patent: 5355577 (1994-10-01), Cohn
patent: 5396195 (1995-03-01), Gabara
patent: 5406848 (1995-04-01), Okada
patent: 5646828 (1997-07-01), Degani et al.
patent: 5708389 (1998-01-01), Gabara
patent: 5838021 (1998-11-01), Ancona
patent: 5847930 (1998-12-01), Kazle
patent: 6141260 (2000-10-01), Ahn et al.
patent: 6256880 (2001-07-01), Ulmer
patent: 6281590 (2001-08-01), Gabara
patent: 6300149 (2001-10-01), Smith
patent: 6465336 (2002-10-01), Gabara
patent: 6597048 (2003-07-01), Kan
patent: 6638627 (2003-10-01), Potter
patent: 6798120 (2004-09-01), Fearing et al.
patent: 6841917 (2005-01-01), Potter
patent: 6856297 (2005-02-01), Durham et al.
patent: 6995039 (2006-02-01), Harris
patent: 7217582 (2007-05-01), Potter
patent: 7225674 (2007-06-01), Clark
patent: 7250826 (2007-07-01), Gabara
patent: 7543497 (2009-06-01), Balogh
patent: 7555950 (2009-07-01), Ruohio et al.
patent: 2001/0053565 (2001-12-01), Khoury
patent: 2004/0046618 (2004-03-01), Sheen
patent: 2004/0080456 (2004-04-01), Tran
patent: 2005/0196981 (2005-09-01), Hashimoto
patent: 2006/0065051 (2006-03-01), Balogh
patent: 2006/0122504 (2006-06-01), Gabara
patent: 2006/0201629 (2006-09-01), Hashizume
patent: 2007/0018739 (2007-01-01), Gabara
patent: 2007/0176704 (2007-08-01), Gabara
patent: 2007/0204706 (2007-09-01), Kishimoto
patent: 2009/0109595 (2009-04-01), Herchen et al.
patent: 2009/0115071 (2009-05-01), Karashima et al.
patent: 08-320231 (1996-12-01), None
patent: 2001-235329 (2000-02-01), None
Appendix of specification, paragraphs [0231] to [0242], filed on Dec. 7, 2007.
Electrical/Optical Issues in I/O CMOS Interfaces, Gabara, T.J.;Optical Interconnect Workshop, Oak Ridge National Laboratory, Oak Ridge, TN, Nov. 8, 1999.—p. TJG 8.
Wheeler, H., “Fundamental Limitations of Small Antennas”, Pro. of the IRE, vol. 35, Issue 12, Dec. 1947, pp. 1479-1484.
Bohringer et al. “Computation Methods for Design and Control of MEMS Micromanipulator Arrays”, Computing in Science and Eng., Jan.-Mar. 1997, (vol. 4, No. 1), pp. 17-29.
Cohn et al., “Microassembly Technologies for MEMS”, Proc. SPIE Micromaching and Microfabrication, Sanata Clara, CA. Sep. 21-22, 1998.
Liu, “Novel Electrostatic Repulsive Forces in MEMS Applications by Nonvolatile Charge Injection”, The 15th IEEE Int. Conf. MEMS, 2002, p. 598-601.
Fearing, “Survey of sticking effects for micro parts handling”, Intelligent Robots and Systems 95, Proc. 1995 IEEE/RSJ Inter, Conf. Aug. 5-9, 1995, pp. 212-217.
Wakayama et al. Nanotechnology, 15,2004, pp. 1446-1449, p. 14.
Nakajima et al Applied Physics Letters 71, Jul. 3, 1997, pp. 353-355.
Academic Press Dictionary of Science and Technology, published 1992, credo reference.

Affiliated with

Also associated with

Rating

Assembling substrates that can form 3-D structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembling substrates that can form 3-D structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembling substrates that can form 3-D structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2663873