Static structures (e.g. – buildings) – Underlying compressible layer or pad
Reexamination Certificate
2007-08-21
2007-08-21
Chilcot, Jr., Richard E. (Department: 3635)
Static structures (e.g., buildings)
Underlying compressible layer or pad
C052S181000, C052S412000, C052S392000
Reexamination Certificate
active
10883239
ABSTRACT:
A module includes at least an associated two-layer structure with one first layer being a polymer base layer highly loaded with mineral fillers contributing to the rigidity of the module, and a second layer made from a printed polymer film defining the decorative part of the module, and the protection of the decorative part. An outer surface of a rigidifying base layer is designed to form a spacer means in the form of a plate of dimensions substantially greater than the format of the module, over all or part thereof, to constitute after abutment of the modules and/or edge jointing of the plate edges, a zone for receiving a sealant such as a binder, putty and like bonding.
REFERENCES:
patent: 2529799 (1950-11-01), Crockett
patent: 4772500 (1988-09-01), Stroppiani
patent: 4832152 (1989-05-01), Schuelke et al.
patent: 4879148 (1989-11-01), Neaves et al.
patent: 5286555 (1994-02-01), Reed
patent: 5824415 (1998-10-01), Kanki et al.
patent: 5891294 (1999-04-01), Shih et al.
patent: 5932337 (1999-08-01), Edinger et al.
patent: 6212838 (2001-04-01), Eda
patent: 6308491 (2001-10-01), Porter
patent: 6558786 (2003-05-01), Jupina
patent: 6571497 (2003-06-01), Aylward et al.
patent: 6599599 (2003-07-01), Buckwater et al.
patent: 6718714 (2004-04-01), Montgomery, Sr.
patent: 296 11 303 (1996-09-01), None
patent: 100 45 475 (2002-04-01), None
patent: 203 042 (1986-11-01), None
patent: 625 170 (1994-11-01), None
patent: WO93/15135 (1993-08-01), None
Bosc Freddy
Ceysson Olivier
Thill Olivier
Chilcot Jr. Richard E.
Geflor
Heslin Rothenberg Farley & & Mesiti P.C.
Nguyen Chi Q.
Rothenberg, Esq. Jeff
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