Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-20
2007-03-20
Datskovsky, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C165S080300, C257S718000
Reexamination Certificate
active
11298298
ABSTRACT:
Structures and methods for holding heat sinks in contact with electronic devices are described herein. In one embodiment, an assembly for holding a heat sink in contact with an electronic device includes a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.
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Cray Inc.
Perkins Coie LLP
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