Assembler device and its assembling method for use in a microcom

Boots – shoes – and leggings

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

395704, 395705, 395708, 364148, G06F 945

Patent

active

059602031

ABSTRACT:
An assembler device comprising a pass-1 processing executing unit for executing a pass-1 processing of generating a code optimization table and a code optimization information-attached symbol table including information at least on attribute and appearance frequency of a symbol appearing in an assembler program, and for estimating a code, a code optimizing unit of correcting the code optimization information-attached symbol table with reference to the code optimization table, and a pass-2 processing executing unit for executing a pass-2 processing of converting the assembler program into an object module file with reference to the corrected code optimization information-attached symbol table.

REFERENCES:
patent: 4398249 (1983-08-01), Pardo et al.
patent: 4763255 (1988-08-01), Hopkins et al.
patent: 5182807 (1993-01-01), Mizuse et al.
patent: 5263162 (1993-11-01), Lundeby
patent: 5437034 (1995-07-01), Tanaka et al.
patent: 5655122 (1997-08-01), Wu
patent: 5742828 (1998-04-01), Canady et al.
patent: 5836014 (1998-11-01), Faiman, Jr.
"622 Mb/s 8 .times. 8 Shared Multibuffer ATM Switch with Hierarchical Queueing and Multicast Functions", Proceedings of the Global Telecommunications Conference (GLOBECOM), Houston, (Nov. 29, 1993-Dec. 2, 1993), IEEE, vol. 3, Nov. 29, 1993, pp. 1488-1495.
Gross, "Object I/O and runtime type information via automatic code generation in C + +", JOOP, pp. 34-42, Jul. 1993.
Patent Abstracts of Japan, vol. 97, No. 1, Jan. 21, 1997, JP 08 234998A.
Patent Abstracts of Japan, vol. 13, No. 284, Jun. 29, 1989, JP 01 068836A.
Patent Abstracts of Japan, vol. 17, No. 502, Sep. 9, 1993, JP 05 127916A.
Patent Abstracts of Japan, vol. 18, No. 24, Jan. 14, 1994, JP 05 257703A.
Patent Abstracts of Japan, vol. 12, No. 62, Feb. 25, 1988, JP 62 205431.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Assembler device and its assembling method for use in a microcom does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Assembler device and its assembling method for use in a microcom, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Assembler device and its assembling method for use in a microcom will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-714354

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.