ASIC compensated pressure sensor with soldered sense die attach

Measuring and testing – Fluid pressure gauge – Mounting and connection

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C073S753000

Reexamination Certificate

active

07930944

ABSTRACT:
An ASIC compensated pressure sensor includes a sense die, an ASIC chip, and supporting elements. The sense die includes a metallized surface for attaching the sense die to a mounting surface. The resulting solder joint provides a hermetic seal that is resistant to a wide range of media associated with different environmental conditions. The mounting surface can contain the ASIC and electronics for compensation or can be attached to another mounting surface, which contains the ASIC and electronics. Either configuration can include collars of different styles for ease of assembly and in turn can be attached to a mating connector. The mounting surface can possess a closely matched coefficient of thermal expansion to the sense die in order to enhance electrical stability of the output signal over a wide temperature and pressure ranges.

REFERENCES:
patent: 4129042 (1978-12-01), Rosvold
patent: 4168630 (1979-09-01), Shirouzu et al.
patent: 4314225 (1982-02-01), Tominaga et al.
patent: 4656454 (1987-04-01), Rosenberger
patent: 4763098 (1988-08-01), Glenn et al.
patent: 4939497 (1990-07-01), Nishida et al.
patent: 5025667 (1991-06-01), Strasser
patent: 5257457 (1993-11-01), Boyer
patent: 5465626 (1995-11-01), Brown et al.
patent: 5811690 (1998-09-01), Hershey
patent: 6351996 (2002-03-01), Nasiri et al.
patent: 6868731 (2005-03-01), Gatesman
patent: 6931938 (2005-08-01), Knirck et al.
patent: 6945120 (2005-09-01), Marcus et al.
patent: 7073375 (2006-07-01), Parker et al.
patent: 7077008 (2006-07-01), Pham et al.
patent: 7194910 (2007-03-01), Gatesman
patent: 7603906 (2009-10-01), Kroger et al.
patent: 7635077 (2009-12-01), Schubert
patent: 7647835 (2010-01-01), Speldrich
patent: 7677109 (2010-03-01), Bentley et al.
patent: 7759945 (2010-07-01), Wade
patent: 7802481 (2010-09-01), Henn et al.
patent: 2007/0271069 (2007-11-01), Dmytriw et al.
patent: 2008/0222884 (2008-09-01), Bradley et al.
patent: 1255099 (2002-11-01), None
patent: 1677090 (2006-07-01), None
patent: 1764598 (2007-03-01), None
patent: 4155233 (1992-05-01), None
patent: 8075581 (1996-03-01), None
patent: 11337431 (1999-12-01), None
patent: 200004667 (2000-02-01), None
patent: 2000180282 (2000-06-01), None
patent: 2000180283 (2000-06-01), None
patent: 2000352540 (2000-12-01), None
patent: 2001208626 (2001-08-01), None
patent: 2003057138 (2003-02-01), None
patent: 20040013538 (2003-12-01), None
Pressure Sensors-Miniature Signal Conditioned 40PC Series, Sensing and Control, Honeywell International, 1999.
Honeywell, “40PC Slides,” 2 pages, prior to May 14, 2008.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

ASIC compensated pressure sensor with soldered sense die attach does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with ASIC compensated pressure sensor with soldered sense die attach, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and ASIC compensated pressure sensor with soldered sense die attach will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2651546

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.