Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hy

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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523458, 524440, 525486, 525504, C08K 308, C08L 6300, C08L 6302, C08L 7900

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active

061144509

ABSTRACT:
An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.

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