Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or

Details Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or

1997-05-21

1999-09-21

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

523458, 524440, 525486, 525504, C08K 308, C08L 6300, C08L 6302, C08L 7900

Patent

active

059555432

ABSTRACT:
An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin alone and/or a diepoxide resin admixed with a hydroxymethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) which can further contain an electrically or thermally conductive filler.

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