Articles having a dielectric layer on a metal substrate having i

Details Articles having a dielectric layer on a metal substrate having i Articles having a dielectric layer on a metal substrate having i

1990-05-11

1992-11-17

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 361400, H05K 100

Patent

active

051645475

ABSTRACT:
The bond of a layer of glass dielectric material applied to metal substrates of the type which are capable of forming solid solutions with copper is enhanced by first coating the substrate with a layer of thick film copper, curing the thick film at a temperature which results in the formation of the solid solution at the interface between the substrate and the thick film copper and then applying the dielectric layer to the thick film copper and curing the dielectric layer. Circuit patterns and components can then be built on the dielectric layer.

REFERENCES:
patent: 3809797 (1974-05-01), McMunn, III
patent: 4409261 (1983-10-01), Kuo
patent: 4713494 (1987-12-01), Oikawa
patent: 4811166 (1989-03-01), Alvarez

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