Article mounting adhesive

Compositions: coating or plastic – Coating or plastic compositions – Wax containing

Patent

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Details

106271, C08L 9106

Patent

active

040522210

ABSTRACT:
A chlorinated naphthalene and a paraterphenyl are mixed to provide an adhesive for adhering a semiconductor wafer to a support for processing.
The adhesive so formed may be evaporated at the end of processing the wafer, without leaving a residue, to release the devices which have been formed from the wafer.

REFERENCES:
patent: 2028716 (1936-01-01), Delaney
Kirk-Othmer, Encyclopedia of Chemical Technology, vol. 7, 1965, pp. 191, 198, 201 and 303.

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