Article having nickel plated film comprising a varying content o

Details Article having nickel plated film comprising a varying content o Article having nickel plated film comprising a varying content o

1989-11-15

1991-02-19

Kaplan, G. L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

204 384, 204 447, 428680, C25D 356, C25D 514, C25D 512, B32B 1501

Patent

active

049943294

ABSTRACT:
A process of nickel plating for forming a plated film having a high phosphorus content according to this invention comprises the steps of: a first step of electroless plating a substance to be plated in an electroless plating bath capable of forming an electroless plated film having a phosphorus content of from 0.20 to 0.25 in atomic ratio of phosphorus with respect to nickel taken as one (1); and a second step of electroplating the substance to be plated by applying an electric current having an electric current density of from 1 to 10 A/dm.sup.2, and the substance to be plated being left immersed in the electroless plating bath continuously, thereby laminating an electroplated film on the surface of the electroless plated film. The process of nickel plating can form a plated film having a remarkably improved wettability with respect to solders since the electroplated film is formed on the electroless plated film having the high phosphorus content. Further, the plated film maintains the good chemical resistance and abrasion resistance of the electroless plated film, and has strong adhesion endurable to the thermal stress and the mechanical stress of an actual service.

REFERENCES:
patent: 3264199 (1966-08-01), Fassell et al.
patent: 4581109 (1986-04-01), Goor et al.

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