Article having microencapsulated adhesive thereon

Envelopes – wrappers – and paperboard boxes – Envelope – Closures

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264 43, 264 433, 264 47, 283 71, 4283215, 4284022, 42840221, 523176, B32B 326, B65D 2716, G09F 310

Patent

active

057093407

ABSTRACT:
A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from a solvent-based adhesive composition such as a styrene butadiene rubber composition an acrylic. The solvent-based adhesive composition may be encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The solvent is removed from the microcapsules by heating or reduced pressure to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.

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