Article formed by electroless plating

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...

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428457, 428901, 428458, 428461, 427304, 427306, B32B 1508, B32B 500, B05D 310

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active

047676655

ABSTRACT:
This invention describes a platable plastic material that uses a phosphide compound as a filler at levels of 5 to 40 weight percent. The phosphide filler used in this way has good dielectric properties and is non-conductive, but the phosphide provides coupling sites for a conductive plating to initiate and to bond to the filler and thus to the plastic. Surface treatment of the plastic may be needed to expose the particles but this invention removes requirements for catalytic treatment with noble metal chlorides and relies on bonding mechanisms other than the mechanical grip on a rough surface.

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patent: 4379803 (1983-04-01), Tamai et al.
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patent: 4404237 (1983-09-01), Eichelberger et al.
patent: 4424095 (1984-01-01), Frisch et al.
patent: 4447492 (1984-05-01), McKaveney
patent: 4456712 (1984-06-01), Christie et al.
patent: 4541894 (1985-09-01), Cassat

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