Article comprising molded circuit

Details Article comprising molded circuit Article comprising molded circuit

1998-10-16

2000-08-29

Lam, Cathy F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Noninterengaged fiber-containing paper-free web or sheet...

4283007, 4283011, 428412, 428413, 428414, 4284259, 428901, 174257, 174258, 361792, 361794, 361795, B32B 506

Patent

active

061105767

ABSTRACT:
An article comprising a molded circuit for providing a path for electrical current is disclosed. The molded circuit is formed of a first material layer and a second material layer. The first material layer is an electrically insulating material. The second material layer is an electrically conductive material. In an alternate embodiment, the second material layer is surrounded between two layers of the first material layer. The molded circuit can be formed using multi-material injection molding such as co-injection molding or two-shot injection molding. A printed circuit board can comprise the molded circuit.

REFERENCES:
patent: 3978378 (1976-08-01), Tigner et al.
patent: 4189524 (1980-02-01), Lazzari
patent: 4710419 (1987-12-01), Gregory
patent: 4755911 (1988-07-01), Suzuki
patent: 5136123 (1992-08-01), Kobayashi et al.
patent: 5542557 (1996-08-01), Koyama et al.
patent: 5571991 (1996-11-01), Highum et al.
patent: 5574630 (1996-11-01), Kresge et al.

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