Article comprising a PB-free solder having improved mechanical p

Details Article comprising a PB-free solder having improved mechanical p Article comprising a PB-free solder having improved mechanical p

1994-06-27

1996-07-23

Simmons, David A.

Alloys or metallic compositions

Tin base

420558, 420559, 420560, 420561, 420562, C22C 1300

Patent

active

055386865

ABSTRACT:
Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183.degree. C..+-.10.degree. C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The novel compositions also can possess superior mechanical properties, compared to the 40/60 Pb-Sn composition, and readily wets copper. Bi and/or Sb may be added to the Sn-In-Zn base to reduce the tendency for the formation of lower temperature phases.

REFERENCES:
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4797328 (1989-01-01), Boehm et al.
patent: 4806309 (1989-02-01), Tulman
patent: 5242658 (1993-09-01), Stevens et al.
W. B. Hampshire, Electronic Materials Handbook vol. 1, Packaging, ASM International, Metals Park, OH, 1989, p. 633.
C. Lea, "A Scientific Guide to Surface Mount Technology", Electrochemical Publications, Ltd. pp. 353-361 (1988).

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