Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1988-03-08
1990-03-13
Simmons, David
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 71, 156 94, 427397, 427441, B65D 7300
Patent
active
049080857
ABSTRACT:
Wrap around article (10) for wood preservative treatment of wood poles, posts and the like, including an outside backing sheet (12) which has an inwardly and downwardly folded mounting flap (18) at the upper end thereof. A single or series of generally flat pockets or bags (30) on the inside of which is an absorbant pad (40). Wood preservative solution is added to the bag (30) and held in the pad (40) and the bag is sealed. The bags are attached to the flap (18). When the wrap around article (10) is to be applied, the inside faces of the bags are cut away exposing the pads soaked with the wood preservative. Upon installation the pads (40) contact substantially all of the circumference of the pole and the wood preservative penetrates the pole wood. In another form the pad material (40') is wrapped around the treatment zone, the pad saturated with wood preservative solution and then the backing (12') is secured over the pad.
REFERENCES:
patent: 195990 (1977-10-01), Culver
patent: 2875020 (1959-02-01), Ring
patent: 2955331 (1960-10-01), Nelson
patent: 3199945 (1965-08-01), Stutz
patent: 3409388 (1968-11-01), Nelson
patent: 3467490 (1969-09-01), Sommer
patent: 3511691 (1970-05-01), Johnson et al.
patent: 4318948 (1982-03-01), Hodgson
patent: 4779735 (1988-10-01), Kelso
Bennett Warren L.
Makus Sharon J.
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