Artical fabrication utilizing lithographic processes

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

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430296, 430311, 430320, 356355, G03F 726

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active

054514800

ABSTRACT:
A procedure for producing an article such as an integrated circuit or a lithographic mask including the step of exposing and developing a resist material during a lithographic process is substantially improved by utilizing a specific technique. In particular, a prototypical plot is made based on typical conditions. Thereafter, this calibration is employable for developing the resist material even at substantially different environmental and processing conditions.

REFERENCES:
patent: 3708229 (1973-01-01), Pircher
patent: 4647172 (1987-03-01), Batchelder
patent: 4851311 (1989-07-01), Millis et al.
Novembre et al. SPIE vol. 1087 Integrated Circuit Metrology, Inspection, and process Control III (1989) pp. 460-468 "An In Situ Interferometric Analysis of Resist Development on Photomask Substrates".
"Optimized Endpoint Exposure for Photoresist Development" (27443) Research Disclosure, Feb. 1987, Number 274.
Ed. L. F. Thompson, C. W. Wilson, M. J. Bowden, ACS Symposium Series 219, American Chemical Society, Washington, D.C. 1983, p. 204.

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