Array type multi-chip device and fabrication method therefor

Details Array type multi-chip device and fabrication method therefor Array type multi-chip device and fabrication method therefor

1999-05-19

2000-12-12

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438109, 438110, 438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

061597686

ABSTRACT:
An array type multi-chip device and a fabrication method therefor form a plurality of devices of the same kind or different kinds into a single chip. The array type multi-chip device includes: an array type sintered body in which a plurality of unit devices are arranged such that internal electrodes of each of the unit devices are exposed at opposite side surfaces of the array type sintered body; glass pastes formed at portions of the side surfaces of the array type sintered body between the internal electrodes of the adjacent unit devices; external electrodes of conductive paste formed to cover the internal electrodes at the surfaces of the sintered body between the adjacent glass pastes and overlapping the glass pastes; and nickel and solder platings formed on surfaces of the external electrodes.

REFERENCES:
patent: 5107586 (1992-04-01), Eichelberger et al.
patent: 5702984 (1997-12-01), Bertin et al.
patent: 5869353 (1999-02-01), Levy et al.

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