Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1999-05-19
2000-12-12
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438109, 438110, 438118, H01L 2144, H01L 2148, H01L 2150
Patent
active
061597686
ABSTRACT:
An array type multi-chip device and a fabrication method therefor form a plurality of devices of the same kind or different kinds into a single chip. The array type multi-chip device includes: an array type sintered body in which a plurality of unit devices are arranged such that internal electrodes of each of the unit devices are exposed at opposite side surfaces of the array type sintered body; glass pastes formed at portions of the side surfaces of the array type sintered body between the internal electrodes of the adjacent unit devices; external electrodes of conductive paste formed to cover the internal electrodes at the surfaces of the sintered body between the adjacent glass pastes and overlapping the glass pastes; and nickel and solder platings formed on surfaces of the external electrodes.
REFERENCES:
patent: 5107586 (1992-04-01), Eichelberger et al.
patent: 5702984 (1997-12-01), Bertin et al.
patent: 5869353 (1999-02-01), Levy et al.
Ceratech Corporation
Collins D. M.
Picardat Kevin M.
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