Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-07-12
2005-07-12
Gushi, Ross (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06916183
ABSTRACT:
An apparatus for receiving a microchip and having a conductor buses therein. A top surface of the apparatus receives the microchip while the bottom surface is to mount to a circuit board. A plurality of pin receptacles pass through the top surface to receive a corresponding plurality of microchip pins of the microchip. The conductor bus resides at least in part between the top surface and the bottom surface and is electrically coupled to a first plurality of the plurality of the pin receptacles.
REFERENCES:
patent: 5683256 (1997-11-01), Werther
patent: 5919259 (1999-07-01), Dahl
patent: 5982635 (1999-11-01), Menzies et al.
patent: 6176709 (2001-01-01), Sonobe et al.
patent: 6347946 (2002-02-01), Trobough et al.
patent: 6551112 (2003-04-01), Li et al.
patent: 6558181 (2003-05-01), Chung et al.
Alger William O.
Brist Gary A.
Long Gary B.
Mejia Carlos
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