Array package connector

Details Array package connector Array package connector

1983-06-16

1985-03-19

Desmond, Eugene F.

Geometrical instruments

174DIG8, 339 17CF, 339 30, 339DIG1, 339 74R, H01R 1320, H01R 13635

Patent

active

045055327

ABSTRACT:
A connector is described for electrical connection and, preferably, the removal of an array package having a plurality of pins with a substrate having contact elements. A first board having a plurality of openings formed therethrough and a second parallel board having a plurality of complementary openings formed therethrough are interconnected by a heat-recoverable metal grid. One end of the grid is connected to the first board and the other end of the grid is connected to the second board to move the boards relative to each other to effect engagement between insertable elements, e.g. the contact elements of the substrate and the pins of an array package.

REFERENCES:
patent: 3783429 (1974-01-01), Otte
patent: 3861030 (1975-01-01), Otte et al.
patent: 3877774 (1975-04-01), Dorrell
patent: 4211459 (1980-07-01), Madden
patent: 4220389 (1980-09-01), Schell
patent: 4412713 (1983-11-01), Nishikawa
W. C. Felts et al., "Zero Insertion Force Module Socket", IBM Technical Disclosure Bulletin, vol. 17, No. 10, Mar. 1975.

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