Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-03-22
1994-06-28
Schwartz, Larry I.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 91, H01R 909
Patent
active
053242050
ABSTRACT:
A high density array of pinless electrical, spring connectors are supported in an electrically insulative carrier. The carrier has an array of cavity nests for receiving the spring connectors, locking them into a stable position and functioning as an electrical coupler between corresponding electrical contact pads in stacked modules.
REFERENCES:
patent: 3934959 (1976-01-01), Gilissen
patent: 4295700 (1981-10-01), Sado
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 5061192 (1991-10-01), Chapin et al.
IBM Technical Disclosure (H. C. Schick), Plated Through-Hole Contact, vol. 6, No. 10, Mar. 1964, pp. 5 & 6.
Ahmad Umar M. U.
Bross Arthur
Czornyj George
Harrison Harry K.
Jones Richard R.
International Business Machines - Corporation
Schwartz Larry I.
Vu Hien D.
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