Array of electronic packaging substrates

Details Array of electronic packaging substrates Array of electronic packaging substrates

1981-05-15

1984-01-24

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

361412, 29418, 29577C, 324 51, H05K 330, H05K 111

Patent

active

044267738

ABSTRACT:
An array of electronic packaging substrates in horizontal and vertical rows in which each substrate has a plurality of internal and external terminals that are electrically interconnected is described. The array has (a) lines of separation along which the substrates may be separated from the array, (b) a plurality of adjacent rows of substrates with lines of separation therebetween that are spaced and parallel, and (c) at least a pair of metallized traces at least one of which runs between the spaced lines of separation, each of which is electrically connected to at least one external terminal in the adjacent rows of substrates and to a contact pad on the array. Selected terminals of substrates in the array are thus electrically connected to a contact pad whereby, after attachment of electronic components to the substrates, the components may be tested in an array format.

REFERENCES:
patent: 3553830 (1971-01-01), Jenny et al.
patent: 3746973 (1973-07-01), McMahon, Jr.
patent: 3830956 (1974-08-01), Wooton et al.
patent: 3839781 (1974-10-01), Russell
patent: 3864810 (1975-02-01), Hargis
patent: 3926746 (1975-12-01), Hargis
patent: 4220917 (1980-09-01), McMahon, Jr.

Affiliated with

Also associated with

Rating

Array of electronic packaging substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Array of electronic packaging substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Array of electronic packaging substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1280636