Array of conductive pathways

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156257, 156265, 156268, 174117FF, 29413, 437226, H01B 708, B32B 328

Patent

active

054136598

ABSTRACT:
The present invention provides metal/polymer composites including a plastic substrate having longitudinally extending conductive members, adapted to make bonded electrical connections to an array of closely spaced conductive terminal pads. In general terms, the metal/polymer composites include a thin, flexible sheet-like plastic substrate having a plurality of longitudinally extending, regularly spaced, metal pathways or members on one major surface thereof.

REFERENCES:
patent: 2897627 (1975-08-01), Klatskin
patent: 3542266 (1970-11-01), Woelfe
patent: 3554832 (1971-01-01), Fischer
patent: 3606035 (1969-08-01), Gantley
patent: 3677875 (1972-07-01), Althouse
patent: 3707760 (1973-01-01), Citrin
patent: 3918150 (1975-04-01), Gantley
patent: 4250217 (1981-02-01), Greenaway
patent: 4296542 (1981-10-01), Gotman
patent: 4549795 (1985-10-01), Simms
patent: 4914815 (1990-04-01), Takada
patent: 4931598 (1990-06-01), Calhoun et al.
patent: 5059262 (1991-10-01), Calhoun et al.
P. H. Wojciechowski, M. S. Mendolia; On the Multiple Fracture of Low-Elongation Thin Films Deposited on High Elongation Substrates. J. Vac. Sci. Technol. A, vol. 7, No. 3, May/Jun. 1989, pp. 1282-1288.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Array of conductive pathways does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Array of conductive pathways, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Array of conductive pathways will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1702555

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.