Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-09-30
1995-05-09
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156257, 156265, 156268, 174117FF, 29413, 437226, H01B 708, B32B 328
Patent
active
054136598
ABSTRACT:
The present invention provides metal/polymer composites including a plastic substrate having longitudinally extending conductive members, adapted to make bonded electrical connections to an array of closely spaced conductive terminal pads. In general terms, the metal/polymer composites include a thin, flexible sheet-like plastic substrate having a plurality of longitudinally extending, regularly spaced, metal pathways or members on one major surface thereof.
REFERENCES:
patent: 2897627 (1975-08-01), Klatskin
patent: 3542266 (1970-11-01), Woelfe
patent: 3554832 (1971-01-01), Fischer
patent: 3606035 (1969-08-01), Gantley
patent: 3677875 (1972-07-01), Althouse
patent: 3707760 (1973-01-01), Citrin
patent: 3918150 (1975-04-01), Gantley
patent: 4250217 (1981-02-01), Greenaway
patent: 4296542 (1981-10-01), Gotman
patent: 4549795 (1985-10-01), Simms
patent: 4914815 (1990-04-01), Takada
patent: 4931598 (1990-06-01), Calhoun et al.
patent: 5059262 (1991-10-01), Calhoun et al.
P. H. Wojciechowski, M. S. Mendolia; On the Multiple Fracture of Low-Elongation Thin Films Deposited on High Elongation Substrates. J. Vac. Sci. Technol. A, vol. 7, No. 3, May/Jun. 1989, pp. 1282-1288.
Calhoun Clyde D.
Koskenmaki David C.
Griswold Gary L.
Gwin, Jr. H. Sanders
Kirn Walter N.
Minnesota Mining and Manufacturing Company
Rainwater Charles
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