Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
Patent
1990-04-27
1991-12-10
Abrams, Neil
Electrical connectors
Including elastomeric or nonmetallic conductive portion
Adapted to be sandwiched between preformed panel circuit...
439591, H01R 909
Patent
active
050713590
ABSTRACT:
Connector and processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed elastomeric sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.
REFERENCES:
patent: Re31114 (1982-12-01), Berg
patent: 2396725 (1946-03-01), Thomas
patent: 2885459 (1959-11-01), Pulsifer
patent: 3192307 (1962-09-01), Lazar
patent: 3193789 (1965-07-01), Brown
patent: 3334275 (1967-08-01), Mandeville
patent: 3349480 (1967-10-01), Rashleigh
patent: 3351702 (1967-11-01), Stephens
patent: 3351816 (1967-11-01), Sear et al.
patent: 3351953 (1967-11-01), Sear
patent: 3357099 (1967-12-01), Nagy et al.
patent: 3436819 (1969-04-01), Lunine
patent: 3465435 (1969-09-01), Steranko
patent: 3499219 (1970-03-01), Griff
patent: 3530411 (1970-09-01), Sear
patent: 3541222 (1970-11-01), Parks et al.
patent: 3542939 (1970-11-01), Mintz
patent: 3605063 (1971-09-01), Stewart
patent: 3606677 (1971-09-01), Ryan
patent: 3613230 (1971-10-01), Griff
patent: 3623037 (1971-11-01), Parks
patent: 3649274 (1972-03-01), Older et al.
patent: 3660726 (1972-05-01), Ammon et al.
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3685145 (1972-08-01), Scarbrough
patent: 3704455 (1972-11-01), Scarbrough
patent: 3705332 (1972-12-01), Parks
patent: 3708874 (1973-01-01), Parks
patent: 3739469 (1973-06-01), Dougherty, Jr.
patent: 3742597 (1973-07-01), Davis
patent: 3760389 (1973-09-01), Scarbrough
patent: 3769702 (1973-11-01), Scarbrough
patent: 3775844 (1973-12-01), Parks
patent: 3795037 (1974-03-01), Luttmer
patent: 3813773 (1974-06-01), Parks
patent: 3837074 (1974-09-01), Griff
patent: 3852878 (1974-12-01), Munro
patent: 3862790 (1975-01-01), Davies et al.
patent: 3917983 (1975-11-01), Kuronen
patent: 3934959 (1976-01-01), Gillissen
patent: 3954317 (1976-05-01), Gillissen et al.
patent: 3967162 (1976-06-01), Ceresa et al.
patent: 4003621 (1977-01-01), Lamp
patent: 4008300 (1977-02-01), Ponn
patent: 4008519 (1977-02-01), Gillissen et al.
patent: 4024631 (1977-05-01), Castillero
patent: 4125310 (1978-11-01), Reardon, II et al.
patent: 4184729 (1980-01-01), Parks et al.
patent: 4199209 (1980-04-01), Cherian et al.
patent: 4225900 (1980-09-01), Ciccio et al.
patent: 4236777 (1980-12-01), Merlina et al.
patent: 4249302 (1981-02-01), Crepeau
patent: 4268956 (1981-05-01), Parks et al.
patent: 4283243 (1981-08-01), Andreades et al.
patent: 4283754 (1981-08-01), Parks
patent: 4295700 (1981-10-01), Sado
patent: 4303715 (1981-12-01), Chang
patent: 4303798 (1981-12-01), Paunovic
patent: 4312897 (1982-01-01), Reimann
patent: 4323593 (1982-04-01), Tsunashima
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4339303 (1982-07-01), Frisch et al.
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4373259 (1983-02-01), Motsch
patent: 4388136 (1983-06-01), Huie et al.
patent: 4394712 (1983-07-01), Anthony
patent: 4402562 (1983-09-01), Sado
patent: 4408814 (1983-10-01), Takashi et al.
patent: 4453795 (1984-06-01), Moulin
patent: 4499655 (1985-02-01), Anthony
patent: 4504783 (1985-03-01), Zasio et al.
patent: 4509099 (1985-04-01), Takamatsu et al.
patent: 4529477 (1985-07-01), Lundberg et al.
patent: 4540229 (1985-09-01), Madden
patent: 4548451 (1985-10-01), Benarr et al.
patent: 4552420 (1985-11-01), Eigenbrode
patent: 4556759 (1985-12-01), Iadarola
patent: 4563543 (1986-01-01), Kersuzan
patent: 4581301 (1986-04-01), Michaelson
patent: 4593961 (1986-06-01), Cosmo
patent: 4608274 (1986-08-01), Wooten
patent: 4610756 (1986-09-01), Strobel
patent: 4631100 (1986-12-01), Pellegrino
patent: 4656314 (1987-04-01), Durand
patent: 4667219 (1987-05-01), Lee et al.
patent: 4667220 (1987-05-01), Lee et al.
patent: 4670091 (1987-06-01), Thomas et al.
patent: 4671854 (1987-09-01), Ishikawa et al.
patent: 4673458 (1987-06-01), Ishikawa et al.
patent: 4675786 (1987-06-01), Mizuko et al.
patent: 4681654 (1987-08-01), Clementi et al.
patent: 4705592 (1987-11-01), Bahrle et al.
patent: 4715117 (1987-12-01), Enomoto
patent: 4715928 (1987-12-01), Hamby
patent: 4720324 (1988-01-01), Hayward
patent: 4737112 (1988-04-01), Jin et al.
patent: 4751126 (1988-06-01), Oodaira et al.
patent: 4770900 (1988-09-01), Seibel
patent: 4774126 (1988-09-01), Dorsey et al.
patent: 4775573 (1988-10-01), Turek
patent: 4788766 (1988-12-01), Burger et al.
patent: 4792646 (1988-12-01), Enomoto
patent: 4813129 (1989-03-01), Karnezos
patent: 4816323 (1989-03-01), Inoue
patent: 4817850 (1989-04-01), Wiener-Avnear et al.
patent: 4830704 (1989-05-01), Voss et al.
patent: 4862588 (1989-09-01), MacKay
patent: 4885126 (1989-12-01), Polonio
patent: 4891014 (1990-01-01), Simpson et al.
patent: 4897164 (1990-01-01), Piano et al.
patent: 4932883 (1990-06-01), Hsia et al.
IBM Bulletin, Loeffel, vol. 20, No. 4, p. 1522, 9-1977.
Shin-Etsu Elastomeric Interconnectors literature.
K. S. Akkapeddi, "The Design of Some Novel 0.050-In. Grid High-Density Circuit Pack-to-Backplane Connectors", EC Conference, 1989, pp. 92-98.
ETI Technical Data Sheet, "Matrix Moe Elastomeric Connectors", 1989.
C. A. Haque, "Characterization of Metal--in -Elastomer Connector Contact Material", IEEE Holm Conference, 1989, pp. 117-121.
W. R. Lambert et al., "Use of Anisotropically Conductive Elastomers in High Density Separable Connectors", IEEE, 1989, pp. 99-106.
E. J. Leddy, "Off-Grid Bare Board Test Technique", IEPS, 1988, pp. 403-409.
J. Lyman, "Metal-In-Elastomer Strip Interfaces to Fine-Pitch Pads", Electronics Design, 1989.
S. Jin et al., "New, Z-direction anisotropically conductive composites", J. Appl. Phys., vol. 64, No. 10, 1988, pp. 6008-6010.
L. T. Romankiw et al., "Plating Through-Holes", IBM Technical Disclosure Bulletin, vol. 9, No. 10, pp. 1255-1256.
Chung et al. "High Performance High Density Connectors Utilizing Multiple Layer Metal/Polymer Construction", 1987 Proceedings--37th Electronic Components Conference.
Howett, "An Advanced High Density Interconnect System for Military/Space Applications", 17th Annual Connectors and Interconnection Technology Symposium Proceedings (Sep. 19-21, 1984).
IBM Research Disclosure No. 32290, 2-1991.
Arnio Barbara E.
Burdick Lynn E.
Owens Mark J.
Simpson Scott S.
St. Lawrence Mike
Abrams Neil
Rogers Corporation
LandOfFree
Array connector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Array connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Array connector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1037023