Arrangement of semiconductor devices on a wafer

Details Arrangement of semiconductor devices on a wafer Arrangement of semiconductor devices on a wafer

1985-10-01

1987-03-31

Munson, Gene M.

357 30, H01L 2978, H01L 2714, H01L 3100

Patent

active

046546812

ABSTRACT:
The yield of field transfer CCD imagers made in a wafer of single crystalline silicon is improved by making the imagers in groups of at least two imagers, and preferably four imagers, with the A-registers of all the imagers in a group being adjacent each other. The groups of imagers are formed in columns on the surface of the wafer with one group being at the center of the wafer and the other group being around the center group and positioned radially outwardly form the center group toward the edge of the wafer.

REFERENCES:
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4362575 (1982-12-01), Wallace

Affiliated with

Also associated with

Rating

Arrangement of semiconductor devices on a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement of semiconductor devices on a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement of semiconductor devices on a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2216084