Arrangement of non-signal through vias and wiring board...

Details Arrangement of non-signal through vias and wiring board... Arrangement of non-signal through vias and wiring board...

2006-05-30

2009-11-10

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S265000, C174S266000, C361S767000, C361S780000, C361S808000, C361S794000, C361S795000

Reexamination Certificate

active

07615708

ABSTRACT:
An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact surface, while the arrangement of non-signal through vias includes first non-signal through vias and a second non-signal through via. The first non-signal through vias pass through the core layer and are electrically connected to some of the contact pads. The second non-signal through via which passes through the core layer is disposed between the first non-signal through vias and is not electrically connected to the contact pads. The interval between the second non-signal through via and anyone of the surrounding first non-signal through vias is smaller than or equal to 0.72 times of the minimum interval between any two of the contact pads electrically connected to the corresponding first non-signal through vias.

REFERENCES:
patent: 2003/0179556 (2003-09-01), Zhao et al.
patent: 2003/0183419 (2003-10-01), Miller et al.
patent: 2005/0161254 (2005-07-01), Clink et al.
patent: 2006/0137905 (2006-06-01), Kariya et al.
patent: 2006/0175083 (2006-08-01), Muramatsu et al.
patent: 2006/0202322 (2006-09-01), Kariya et al.
patent: 2006/0219427 (2006-10-01), Haridass et al.
patent: 2007/0029106 (2007-02-01), Kato
patent: 2007/0034405 (2007-02-01), Brown
patent: 2008/0277152 (2008-11-01), Watanabe

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