Arrangement of bonding IC chip to liquid crystal display device

Details Arrangement of bonding IC chip to liquid crystal display device Arrangement of bonding IC chip to liquid crystal display device

1994-02-07

1995-11-14

Gross, Anita Pellman

Optical: systems and elements

Holographic system or element

Using a hologram as an optical element

359 85, G02F 11343

Patent

active

054672104

ABSTRACT:
A board-shaped lower glass substrate of a liquid crystal display (LCD) device has a size larger than a board-shaped upper glass substrate of the LCD device. An edge of part of the lower glass substrate extending beyond a corresponding edge of the upper glass substrate has a plurality of IC chips mounted thereon. Output pads connected to output electrodes of the IC chips are mounted to that edge of the lower glass substrate on the side of the display area of the LCD device. Input pads connected to input electrodes of the IC chips are mounted to that edge of the lower glass substrate on the side remote from the display area. Wiring patterns formed on that edge of the lower glass substrate and connected to the input and output pads extend along the direction of an arrangement of IC the chips. One end of each wiring pattern is positioned at an edge of the lower glass substrate. This arrangement enables the LCD module to be connected to a control device outside the LCD module by a single flexible connector with a single side wiring pattern being formed.

REFERENCES:
patent: 4042861 (1977-08-01), Yasuda et al.
patent: 4422731 (1983-12-01), Droguer et al.
patent: 5189539 (1993-02-01), Suzuki
patent: 5200847 (1993-04-01), Mawatari et al.
patent: 5270848 (1993-12-01), Takabayashi et al.
patent: 5349226 (1994-09-01), Kawaguchi et al.

Affiliated with

Also associated with

Rating

Arrangement of bonding IC chip to liquid crystal display device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement of bonding IC chip to liquid crystal display device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement of bonding IC chip to liquid crystal display device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1224992