Arrangement of a semiconductor device for use in a card

Electricity: conductors and insulators – Feedthrough or bushing – Compression

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174 524, 357 70, H01L 2328

Patent

active

049611054

ABSTRACT:
A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein a metal layer is formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed. The semiconductor pellet is secured to the circuit board by bonding the metal layer to the circuit board and is sealed with a high polymer material on the circuit board.

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WO 82/02457, International Publ #, 7/82 including International Patent Search, 10 pages.
34th Electronic COmponents Conference, 4 pages, New Orleans, La., May 14-16, 1984.

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