Arrangement of a chemical-mechanical polishing tool and...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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Details

C451S056000

Reexamination Certificate

active

07025662

ABSTRACT:
The invention relates to an arrangement of a chemical-mechanical polishing tool for chemical-mechanical polishing a surface on a wafer, comprising a polishing pad (4), a drive unit (9), pressing means (6), a wafer holder (5), first dispensing means (7) and second dispensing means (8); the wafer holder for holding a wafer (W) being arranged at a holder location (L0); the pressing means (6) being arranged to press the wafer holder (5) to the polishing pad (4); the first dispensing means (7) for dispensing a first fluid on the polishing pad (4) being arranged at a first dispensing means location (L1); the second dispensing means (8) for dispensing a second fluid on the polishing pad (4) being arranged at a second dispensing means location (L2); the polishing pad (4) comprising a polishing surface for polishing the wafer (W), and the polishing pad (4) further being connected to the drive unit (9) for moving the polishing surface in a first direction (ω1) relative to the holder location (L0);wherein the first dispensing means location (L1) of the first dispensing means (7) is arranged in a downstream direction with respect to the holder location (L0) at a first downstream distance (d1), with the downstream direction being taken in relation to the first direction (ω1); and the second dispensing means location (L2) of the second dispensing means (8) is arranged in an upstream direction with respect to the holder location (L0) at a first upstream distance (d3), with the upstream direction being taken in relation to the first direction (ω1).The invention further relates to a method of chemical-mechanical polishing using such an arrangement.

REFERENCES:
patent: 5478435 (1995-12-01), Murphy et al.
patent: 5578529 (1996-11-01), Mullins
patent: 5651725 (1997-07-01), Kikuta et al.
patent: 5981394 (1999-11-01), Ohashi et al.
patent: 6120347 (2000-09-01), Sandhu et al.
patent: 6227947 (2001-05-01), Hu et al.
patent: 6398627 (2002-06-01), Chiou et al.
patent: 6429131 (2002-08-01), Lin et al.

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