Arrangement in semiconductor packages for inhibiting...

Details Arrangement in semiconductor packages for inhibiting... Arrangement in semiconductor packages for inhibiting...

2006-09-06

2009-08-11

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S121000, C438S125000

Reexamination Certificate

active

07572677

ABSTRACT:
In a semiconductor flip-chip package having a semiconductor die as part of a substrate assembly, a lid (or lid assembly) and substrate are supported to prevent tilting and teetering of the lid. The lid and substrate do not adhere, so as to reduce cracking of solder joints due to thermal cycling induced by repeated system power on-off. An adhesion prohibitor may be applied so that a support does not adhere to both lid and substrate; the support may be prevented from adhering to both lid and substrate by a separate curing step. The arrangements and fabrication methods may be applied to many package types, including ball grid array (BGA) and land grid array (LGA) packages.

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