Arrangement in cooling electronic equipment

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05H 720

Patent

active

059826185

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates to an arrangement that may be used to cool electronic equipment, or a set of electronic assemblies, where said electronic equipment is housed in a rack or a rack arrangement.
The rack arrangement is equipped with a means for transferring heat energy produced by said equipment to one or more rack-related cooling units.
The cooling units are designed to be able to transfer heat energy by means of convection to the ambient air about the rack and equipment.
At least one of said cooling units contains vertically-oriented cooling flanges, positioned next to one another.
The present invention is even based on the ability to use a fan unit, when necessary, that is designed to be able to provide the cooling unit and the cooling flanges with a stream of forced air, thereby increasing heat dissipation from the cooling flanges to the ambient air.


BACKGROUND ART

Several different embodiments exist for arrangements that may be used for cooling electronic equipment that is housed in a rack arrangement with means for transferring heat energy that is produced in said equipment to one or more rack-related cooling units.
Cooling units with associated cooling flanges have even been arranged to provide requisite cooling, by designing and adapting the cooling unit to transfer sufficient heat energy by means of convection to the ambient air about the rack and the equipment.
It has also been shown that the heat-emitting capacity may be increased, continuously or temporarily, by using a fan unit that is designed to be able to supply the cooling unit and the cooling flanges with a stream of forced air as needed.
As examples of background art we refer to the following publications:
This publication describes an arrangement for cooling electronic equipment while using a fan unit in order to generate a forced cooling stream of air.
More specifically an arrangement is described where two incoming streams of air are permitted to pass through an upper (31) and a lower (32) opening with opposing air streams enclosed in a duct in order to pass along cooling flanges of a mutual cooling unit (33). The fan unit is positioned in the centre area of the cooling flanges.
This publication describes that cooling flanges (5) can be encompassed by a separate wall section (13) in order to form an enclosed cooling duct. A fan unit (16) is connectable to the lower part of the cooling duct and a forced stream of air is allowed to pass along the complete cooling duct.
This publication describes an arrangement for cooling electronic equipment while using a fan unit in order to generate a forced cooling stream of air.
More specifically this publication describes an enclosure of electrical material, where the heat, generated within the enclosure (1), is conducted to the surroundings through heat exchanging between an inner and an outer air stream. At least part of the casing of the enclosure is provided with surface enlargements in order to increase the heat emission. The casing is therefore preferably given a wave-form (5) with a surface that, besides this, is provided with grooves. It is only required to supplement such enclosure with a simple cover (9) and a fan system to obtain an effective heat exchanger with a forced air stream.
This publication describes an arrangement for cooling electronic equipment while using a fan unit in order to generate a forced cooling stream of air.
It is described that air is allowed to pass through a nozzle (87) into a cooling system (90) with a number of vents (88) in order to conduct the heat from the system. The package, including the system, is positioned on one side of the casing of the equipment.
This publication describes an arrangement for cooling electronic equipment while using a fan unit in order to generate a forced cooling stream of air.
It is specifically shown that heat is dissipated to the ambient air through corrugated roof (35) and side panels.
This publication describes an arrangement for cooling electronic equipment while using a fan unit in order to gen

REFERENCES:
patent: 3268772 (1966-08-01), Kamei et al.
patent: 4620263 (1986-10-01), Ito
patent: 5040095 (1991-08-01), Beaty et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Arrangement in cooling electronic equipment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement in cooling electronic equipment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement in cooling electronic equipment will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1464860

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.