Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1993-07-28
1995-12-12
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257758, H01L 3902
Patent
active
054752647
ABSTRACT:
According to this invention, there is provided a multilevel wiring substrate comprising, a base substrate having first and second surface and including first and second areas, said first area including first and second level conductive layers insulated from each other, a plurality of first vertical conductive layers electrically connected to said first level conductive layer so as to provide first end portions exposed to said first surface, and a plurality of second vertical conductive layers electrically connected to said second level conductive layer so as to provide second end portions exposed to said first surface, said first and second end portions being alternately arranged in row and column directions, and said second area including third and fourth conductive layers.
REFERENCES:
patent: 4721831 (1988-01-01), Vora
patent: 4954877 (1990-09-01), Nakanishi et al.
"A Comparison of Thin Film, Thick Film, And Co-Fired High Density Ceramic Multilayer With The Combined Technology: T&T HDCM (Thin Film and Thick Film High Density Ceramic Module)", Terasawa et al., Proceedings of ISHM, pp. 607-615 (1983).
Ito Kenji
Sudo Toshio
Kabushiki Kaisha Toshiba
Mintel William
Potter Roy
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