Arrangement for transferring information/structures to wafers

Details Arrangement for transferring information/structures to wafers Arrangement for transferring information/structures to wafers

2008-07-22

2008-07-22

Nguyen, Anthony H. (Department: 2854)

Printing

Embossing or penetrating

C101S004000

Reexamination Certificate

active

10802618

ABSTRACT:
An arrangement for transferring information/structures to wafers uses a stamp on which the information/structures to be transferred have been applied as elevated structures. The wafer is fixed on a chuck and is provided with a plastically deformable auxiliary patterning layer. In various implementations, the dimensions of the stamp approximately correspond to those of the wafer, the stamp is provided with the elevated structures essentially over the whole area, and/or the stamp and the wafer are in each case provided with mutually assigned pairs of alignment marks in such a way that the stamp can be positioned in a predetermined position on the wafer by means of an infrared positioning system and can be pressed into the plastically deformable auxiliary patterning layer.

REFERENCES:
patent: 5243195 (1993-09-01), Nishi
patent: 5268744 (1993-12-01), Mori et al.
patent: 5414514 (1995-05-01), Smith et al.
patent: 5775215 (1998-07-01), Hirate
patent: 5801832 (1998-09-01), Van Den Brink
patent: 5866281 (1999-02-01), Guckel et al.
patent: 6342941 (2002-01-01), Nei et al.
patent: 6707545 (2004-03-01), Hunter
patent: 6716665 (2004-04-01), Baba et al.
patent: 6811938 (2004-11-01), Tutt et al.
patent: 6916584 (2005-07-01), Sreenivasan et al.
patent: 6975040 (2005-12-01), Dower et al.
patent: 7139083 (2006-11-01), Fielden et al.
patent: 2001/0026638 (2001-10-01), Sangu et al.
patent: 2001/0026897 (2001-10-01), Shima
patent: 2002/0037460 (2002-03-01), Takahashi
patent: 2002/0076896 (2002-06-01), Farrar et al.
patent: 2002/0115002 (2002-08-01), Bailey et al
patent: 2002/0163054 (2002-11-01), Suda
patent: 2002/0170880 (2002-11-01), Chen
patent: 2004/0021254 (2004-02-01), Sreenivasan et al.
patent: 2004/0021866 (2004-02-01), Watts et al.
patent: 2004/0022888 (2004-02-01), Sreenivasan et al.
patent: 2004/0023466 (2004-02-01), Yamauchi
patent: WO 02/067055 (2002-08-01), None
patent: WO 2004/013693 (2004-02-01), None
White, D.L., et al., “Novel Alignment System for Imprint Lithography,” J. Vac. Sci. Technol. B vol. 18, No. 6, Nov./Dec. 2000, pp. 3552-3556.
Deng, Y., et al., “Simulation of Exposure and Alignment for Nano-imprint Lithography,” Proceedings of the SPIE, The International Society for Optical Engineering, USA, 2002, vol. 4688, No. 1-2, pp. 842-849.

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