Arrangement for tightly enclosing a substrate

Stock material or miscellaneous articles – Hollow or container type article – Shrinkable or shrunk

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428 351, 428192, 428913, 174DIG8, 138 99, 138103, 138110, 138128, 138163, 138167, 138168, 24336, H02G 1518

Patent

active

057336148

ABSTRACT:
An arrangement for tightly enclosing a substrate with a heat-shrinking plastic sleeve (1), which has thickened sections (2, 3) along its longitudinal edges, has at least two rails (4, 5) pushed on the sleeve (1) after it has been placed around the substrate. The rails hold the longitudinal edges of the sleeve (1) together before, during and after the heat-shrinking. The two rails (4, 5) form a junction area and S-shaped profiles (6, 7) are placed in the junction area on both sides of the thickened edge sections (2, 3) and are enclosed by both of the rails (4, 5).

REFERENCES:
patent: 3847721 (1974-11-01), Evans
patent: 4219051 (1980-08-01), D'Haeyer
patent: 4283239 (1981-08-01), Corke et al.
patent: 4689474 (1987-08-01), Overbergh et al.
patent: 4860799 (1989-08-01), Van Noten
patent: 4900596 (1990-02-01), Peacock
patent: 4952437 (1990-08-01), Winterhoff et al.
patent: 4954213 (1990-09-01), Jos et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Arrangement for tightly enclosing a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement for tightly enclosing a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement for tightly enclosing a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-49694

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.