Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Patent
1986-09-26
1989-07-04
Eisenzopf, Reinhard J.
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With rotor
324 725, 324158F, 414 7, G01R 104, G01R 1073
Patent
active
048454273
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an arrangement for the measurement of electronic units with a large number of connection points situated close to one another, as in the case of boards with integrated circuits.
For the conventional fault locating and testing of integrated circuits provided with connection leads and installed inside a housing or directly on a board, use is made at the present time of measuring probes which are connected to an oscilloscope on which can be read the signal levels for the test object.
TECHNICAL PROBLEM
In order to hold the housing or possibly a small circuit board in position for measurement in the probe, the use of a mechanical fixture is familiar. As a result of this probe is of large format, and only one measurement at a time can be performed on the same circuit board.
The aforementioned method is beset with major technical problems when testing circuit boards with high integrated density due to the fact that the distance between the connection leads of the board is very small, as a result of which it is difficult to connect the board to the measurement equipment. The method is very time-consuming because of the need to observe great accuracy during the measurement in order for correct connection to be achieved and for it to be possible for short-circuiting to be avoided, with measurement being possible at only one point of measurement at a time. The available equipment for measurement purposes cannot be regarded as being suited to its intended use.
THE SOLUTION
The arrangement in accordance with the invention comprises a measuring device with a fastening member by means of which the arrangement is secured to the electronic unit in a specific, fixed position, in conjunction with which spring-loaded contact elements provided on the measurement device are so arranged as to come into electrical contact with measuring points on the electronic unit. The fastening member is provided with a recess which is connected via an elongated, tubular and flexible element to an air suction arrangement, such that the electronic unit can be secured in the recess by means of negative pressure which is produced by means of the air suction unit when the electronic unit is fitted into the recess. The spring-loaded contact elements are in electrical contact with measuring instruments which may be of a previously disclosed type.
ADVANTAGES
Obtained through the invention is an arrangement for the measurement of signal levels in electronic units, such as in integrated circuit boards, for both fault locating and for manufacturing inspection purposes, which is of small format and which eliminates the aforementioned problems by the unit being capable of being connected at all its points of measurement in a single operation.
The aforementioned object is achieved by means of an arrangement in accordance with the characterizing part of Patent Claim 1 following.
DESCRIPTION OF THE DRAWINGS
The invention is described below in greater detail in relation to an illustrative embodiment with reference to the accompanying drawings, in which
FIG. 1 shows a view from above of the arrangement,
FIG. 2 shows a section along line II--II in FIG. 1, and
FIG. 3 shows a perspective view of the arrangement with its associated connection box.
PREFERRED EMBODIMENT
As can be appreciated from FIG. 2, the arrangement in accordance with the invention constitutes a measuring probe comprising a holder 1, preferably made of a plastics material such as plexiglass, said holder exhibiting measuring pins 2, the one end parts of which are provided with conical recesses 3. The measuring pins also exhibit at their other end part oblique end surfaces 4 set at an angle of about 45.degree. in relation to their longitudinal direction. The measuring pins are flexibily arranged in sleeves 6 by means of springs 7, preferably helical springs, which are in contact with one end part against balls 5 which are forced by the pressure of the spring against the respective end surfaces 4 of the pins 2. The sleeves are arrange
REFERENCES:
patent: 1910827 (1933-05-01), Fedstoff
patent: 3284964 (1966-11-01), Saito
patent: 4061969 (1977-12-01), Dean
patent: 4621965 (1986-11-01), Wilcock
patent: 4625164 (1986-11-01), Golder et al.
"Wafer Handling Fixture", by Slayton, IBM Tech. Disc. Bull., vol. 11, #7, 12/68, p. 863.
"Chip Alignment Probe", by Chizu et al., IBM Tech. Disc. Bull., vol. 12, #10, 3/70, p. 1547.
Burns W.
Eisenzopf Reinhard J.
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