Arrangement for surface mounting of subassemblies on a...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S803000, C361S736000, C439S065000, C439S079000, C439S637000

Reexamination Certificate

active

07027305

ABSTRACT:
The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.

REFERENCES:
patent: 5482474 (1996-01-01), Yohn et al.
patent: 5871362 (1999-02-01), Campbell et al.

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