Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-06-27
2006-06-27
Tang, Minh N. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S755090
Reexamination Certificate
active
07068059
ABSTRACT:
An arrangement for producing an electrical connection between a ball grid array (BGA) package and a signal source is disclosed. A flexible printed circuit board (PCB) has conductor (e.g., copper) tracks arranged between flexible plastic layers. A contact receptacle with guide elements for the BGA package is located over a portion of the flexible PCB. Contact structures are electrically coupled to the conductor tracks of the flexible PCB and accessible via the contact receptacle. The contact structures serve for providing an electrical contact-connection of terminals of a BGA package placed in the receptacle. The contact structures comprise column- or sleeve-shaped contact elements that extend through the flexible PCB and project upwards on one side from one of the flexible plastic layers.
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Dobritz Stephan
Hanke Andre
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