Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-12-18
1994-06-21
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
622592, 16510433, 257716, 361711, H05K 720
Patent
active
053232933
ABSTRACT:
A low temperature conduction module comprising a cold plate having recesses around the periphery thereof to accommodate memory cubes is disclosed. The recesses accommodating the memory cubes are of such depth and dimension as to enclose the memory cube on all but one side, thereby greatly enhancing the conduction of the heat generated by the memory cube to the cold plate. The memory cube may be surrounded by a material which possesses excellent thermal conductive properties to insure efficient transfer of the heat from the memory cube to the cold plate. The plurality of memory cubes so positioned within the cold plate may be connected by a flexible cable surrounding the cold plate and having branch conductors extending to connect with computer processors enclosed within the same low temperature conduction module.
REFERENCES:
patent: 4330812 (1982-05-01), Token
patent: 4630096 (1986-12-01), Drye
patent: 4962444 (1990-10-01), Niggemann
patent: 4986078 (1991-01-01), Laskaris
patent: 5095404 (1992-03-01), Chao
patent: 5121292 (1992-06-01), Bell et al.
patent: 5126830 (1992-06-01), Mueller
patent: 5142443 (1992-08-01), Moore, Jr.
IBM Tech Discl. Bull. vol. 21 No. 8 Jan. 1979, pp. 3378-3380, Ahearn, "Silicon Heat Sink . . . ".
IBM Tech. Discl. Bull. vol. 20 No. 7 Dec. 1977, pp. 2759, Hwang, "Liquid . . . Module".
Angiulli John M.
Ghose Arun K.
Konian Richard R.
Levine Samuel R.
Moran Kevin P.
International Business Machines - Corporation
Tolin Gerald P.
LandOfFree
Arrangement for placing central processors and memory in a cryo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Arrangement for placing central processors and memory in a cryo , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement for placing central processors and memory in a cryo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2224790