Arrangement for mounting dual-in-line packaged integrated circui

Details Arrangement for mounting dual-in-line packaged integrated circui Arrangement for mounting dual-in-line packaged integrated circui

1979-12-19

1981-06-09

Abrams, Neil

Geometrical instruments

H05K 112

Patent

active

042721407

ABSTRACT:
An arrangement for mounting a dual-in-line packaged integrated circuit (DIP) to a thick/thin film circuit wherein a portion of each DIP lead is formed into a U-shape including a horizontal foot portion. The arrangement further includes a complementary socket which accepts the U-shaped DIP leads in opposite sides thereof. The socket is then soldered to either a thick/thin film circuit of a circuit board.

REFERENCES:
patent: 4089575 (1978-05-01), Grabbe

Affiliated with

Also associated with

Rating

Arrangement for mounting dual-in-line packaged integrated circui does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement for mounting dual-in-line packaged integrated circui, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement for mounting dual-in-line packaged integrated circui will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1260492