Arrangement for mounting and cooling high density tab IC chips

Details Arrangement for mounting and cooling high density tab IC chips Arrangement for mounting and cooling high density tab IC chips

1990-02-26

1992-03-10

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 16510433, 174 152, 361388, 361400, H05K 720

Patent

active

050954040

ABSTRACT:
A printed circuit board assembly includes a printed circuit board having a top side, a bottom side and a hole. A heat spreader which comprises a plate made of a material having high thermal conductivity is mounted on the bottom side of the printed circuit board. The plate includes a pedestal which extends up into the hole. A high density TAB IC chip is mounted on top of the pedestal and is electrically connected to pads on the top side of the printed circuit board. A heat pipe is mounted underneath the plate of the heat spreader through a mounting pad which is fixed to the heat pipe and which is made of a material having good thermal conductivity. In operation, heat generated by the chip during use is spread out by the heat spreader and then removed by the heat pipe.

REFERENCES:
patent: 2862158 (1958-11-01), Stelmak
patent: 4204246 (1980-05-01), Arii
patent: 4394530 (1983-07-01), Kaufman
patent: 4563725 (1986-01-01), Kirby
patent: 4628407 (1986-12-01), August
patent: 4731693 (1988-03-01), Berg
patent: 4849857 (1989-07-01), Butt
patent: 4860165 (1989-08-01), Cassinelli
patent: 4966226 (1990-10-01), Hamburgen
patent: 4982311 (1991-01-01), Dehaine
"Substrate--Cooling", IBM Tech Discl Bull Bakelaar, vol. 14, No. 9, Feb. 1972, pp. 2690.

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