Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
1999-11-17
2001-07-31
Tran, Minh Loan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S696000, C257S698000, C257S774000
Reexamination Certificate
active
06268651
ABSTRACT:
FIELD OF INVENTION
The present invention relates to a method of surface mounting an upstanding component on a carrier, and also to an arrangement for surface mounting an upstanding component on a carrier.
DESCRIPTION OF THE PRIOR ART
Present day components that are intended to be mounted upstanding on a circuit board for instance often have straight leads for insertion into holes such as to affix the component on the board and to establish an electric contact between component and board. The leads may be disposed in a Single-In Line formation (SIL formation). In mounting such a component on a circuit board, the leads are inserted into metallized holes provided in the board and the component is held firmly in the holes through the interaction of the leads, an electrical connection being established in the holes so as to obtain the requisite electrical contact between component leads and circuit board.
SUMMARY OF THE INVENTION
There is a trend in the electronics industry toward the preference for surface mountable components that can be mounted on such carriers as circuit boards. Components of this nature take up less space on a circuit board as seen totally, since it obviates the need to provide a large number of holes for instance. Such holes may make the drawing of conductors in underlying layers difficult to achieve. Furthermore, it is possible to rationalise circuit board production processes when solely surface mounted components can be used. Because hole mounting processes and wave soldering processes can be dispensed with, production is both simpler and less costly.
By using surface mountable leads on a component in conjunction with a “Single-In-Line” technique, wherewith the leads may be bent at their bottom extremities and provided with feet for contact with the circuit board, and wherewith guide/support pins are used to hold the component mechanically in place during the process of mounting and connecting the component and to brace the leads on the finished board, it is possible to mount an upstanding component on a circuit board with the component leads surface mounted on the board.
The surface mounted contact leads may be produced from existing lead frames or specially adapted contact leads. The leads may be bent to an appropriate shape with the aid of tools for forming feet on the respective leads, such that the leads will be connected effectively to board connection surfaces and be independent of the position taken by the component when mounted.
The guide and support pins will preferably be two or more in number and may be straight or slightly curved, but will always be longer than the connecting leads so that they can be inserted into guide holes in the circuit board. The guide and support pins enable the component to be mounted without the aid of loose fixtures. The use of a guide and support pin with few leads is also conceivable, depending on the field of use and the size of the component concerned.
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patent: 5629839 (1997-05-01), Woychik
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patent: 1257235 (1967-12-01), None
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patent: 387816 (1976-09-01), None
Eriksson Mats
Hellgren Eva
Burns Doane Swecker & Mathis L.L.P.
Telefonaktiebolaget LM Ericsson (publ)
Tran Minh Loan
LandOfFree
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