Arrangement for monitoring the temperature in flow soldering of

Details Arrangement for monitoring the temperature in flow soldering of Arrangement for monitoring the temperature in flow soldering of

1989-10-19

1991-01-01

Orsino, Joseph A.

Communications: electrical

Condition responsive indicating system

Specific condition

228 9, G08B 1700, B23Q 1500

Patent

active

049821776

ABSTRACT:
A pyrometer is located beneath a soldering path downstream of a flow nozzle and is shielded by a metal plate which extends transversely relative to the soldering direction and obliquely upwardly toward the path. The pyrometer is connected to a limit value generator which responds when the limit value is exceeded.

REFERENCES:
patent: 3750134 (1973-07-01), Weisend
patent: 4447805 (1984-05-01), Omae et al.
patent: 4596615 (1986-06-01), Matsuzaki et al.
patent: 4632291 (1986-12-01), Rahn et al.
patent: 4659003 (1987-04-01), Simonetti
patent: 4890781 (1990-01-01), Johnson et al.

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