Arrangement for holding together a package of boards for printed

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156513, 156517, 156524, 156528, 156253, 356256, 356373, 257724, 257701, B32B 3300

Patent

active

052136477

ABSTRACT:
An arrangement for holding together a package of boards to be used in the manufacture of printed circuits by applying glue to an edge of the package or by applying glue into holes formed in the boards.

REFERENCES:
patent: 2557668 (1951-06-01), Lincoln
patent: 3616034 (1971-10-01), Obergfell
patent: 4019826 (1977-04-01), Block
patent: 4480364 (1984-11-01), Koswoski
patent: 5066531 (1991-11-01), Legg et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Arrangement for holding together a package of boards for printed does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement for holding together a package of boards for printed, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement for holding together a package of boards for printed will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-894836

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.