Arrangement for hermetically sealing components, and method...

Details Arrangement for hermetically sealing components, and method... Arrangement for hermetically sealing components, and method...

2011-03-01

2011-03-01

Ngo, Hung V (Department: 2835)

Electricity: conductors and insulators

Anti-inductive structures

Shielded

C174S564000, C174S524000, C257S680000, C257S659000

Reexamination Certificate

active

07897881

ABSTRACT:
Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically sealing protective layer is impermeable to gas, liquid, and electromagnetic waves, temperature-resistant, electrically insulating, and process-resistant.

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